The invited talks in the CHIPs Mini-Symposium provide an overview of key areas of this CHIPs and Science Act of 2022. The National Institute of Science and Technology is leading this national effort to achieve a lasting dominance for the United States in integrated circuit technology. First, Dr. David Lavin (NIST) will provide an overview of the key goals of the CHIPs Act. Then, Dr. David Anderson, President of the New York Center for Research, Economic Advancement, Technology, Engineering, and Science (NY CREATES), will provide an overview of how research centers such as the National Semiconductor Technology Center (NSTC) will advance integrated circuit research and thus manufacturing in the United States. Dr. Steven Pawlowski (Micron) will describe advances in memory IC technology that also help achieve improved energy efficiency and greater capacity. As new integrated circuits are developed, the need to decrease power use will drive changes in IC architecture. Jan Vardaman of Tech Search International will discuss these changes in her invited talk. Prof. and Acting Dean of Engineering Mark Lundstrom (Purdue University) will provide an overview of the critical area of workforce development.
Wide- and ultra-wideband gap semiconductor devices are the key elements in the next generation high power/high-frequency electronics. Dr. Luke Yates from Sandia National Laboratories will survey the current optical, acoustic, and electrical characterization efforts at Sandia to visualize and quantify interfacial properties, defects, and undesirable electronic charges within (U)WBG materials and devices. Along these lines, Dr. Yamaguchi Takahide (National Institute for Materials Science) will report on recent breakthroughs in high-mobility diamond electronics.
The CHIPs Act focuses on new manufacturing capability and advancing R&D will drive an increase in new jobs at all levels of education.
CPS+CA-WeA: CHIPS Act: Interfaces and Defects
- Yamaguchi Takahide, National Institute for Materials Science, Japan, “Diamond/h-BN Heterostructures for High-Performance Electronics”
- Luke Yates, Sandia National Laboratories, “Future Needs and Current Trends in Interfacial Metrology for the Development of Reliable Ultra-Wide Bandgap Electronics”
CPS+MS-ThM: Chips and Science Act Implementation for Microelectronics (Including Workforce)
- David Anderson, NY CREATES, “U.S. CHIPS Act and Semiconductor R&D Centers: Accelerating American Innovation”
- David Lavan, National Institute for Science and Technology (NIST), “The Goals for the CHIPS and Science Act of 2022”
- Mark Lundstrom, Purdue University, “Re-Shoring and Re-Energizing Microelectronics: the Workforce Challenge”
- Steve Pawlowski, Micron, “A View on the 1000x Performance Efficiency Goal”
- Jan Vardaman, TechSearch International, Inc., “Saving Power with New Designs and Chiplets in the New Era of Advanced Packaging”