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Abstract Submission

Home Abstract Submission

Call for Late-Breaking Abstracts Deadline:
September 15, 2023 (11:59 p.m. ET)

Abstract Submission Guidelines

Please review Steps 1-5 below before entering the online abstract submission site.

  • Step 1

    Before signing up or logging into the online system (in Step 5), please review all of the following steps to ensure you have the information needed to complete the abstract submission process.

    Please Note the Following Requirements Prior to Submission:

    1. If you are planning to submit multiple abstracts, presenters are limited to one oral and one poster presentation.
    2. If you already have accepted abstracts scheduled in the program, please note that you can only have one oral and one poster in the program total so please keep this in mind when submitting a late breaking abstract.
  • Step 2

    Select a a session topic from the list below. Note that all sessions have Late Breaking Oral, Late Breaking Poster, and Late Breaking On Demand submission options (except the undergraduate poster session)

  • Step 3

    Fill out the abstract content and author details in the system (abstract 2,700 characters max. including grammar and spacing; you may also submit a supplemental 1 page PDF file containing any graphs, charts or pictures you wish to include).

  • Step 4

    Agree to the copyright agreement.  If you have questions e-mail yvonne@avs.org.

STEP 5

Due by 11:59 p.m. ET

SUBMIT BY September 15

Author Notification

Acknowledgment that your abstract has been submitted will follow by e-mail shortly after submission with official acceptance/scheduling emails to be sent by early August. The Call for Late Breaking submissions will launch in early August and acceptance/scheduling notifications will be emailed in mid-September.

Topics

2D Materials (2D)
Actinides and Rare Earths (AC)
Advanced Focused Ion Beams (IB)
Advanced Surface Engineering (SE)
Applied Surface Science (AS)
Atomic Scale Processing (AP)
Biomaterial Interfaces (BI)
Chemical Analysis and Imaging of Interfaces (CA)
CHIPS Act (CPS)
Electronic Materials and Photonics (EM)
Exhibitor Technology Spotlight (EW)
Fundamental Discoveries in Heterogeneous Catalysis (HC)
Laboratory-Based Ambient-Pressure X-ray Photoelectron Spectroscopy (LX)
Light Sources Sciences (LS)
Magnetic Interfaces and Nanostructures (MI)
Manufacturing Science and Technology (MS)
MEMS and NEMS (MN)
Nanoscale Science and Technology (NS)
Plasma Science & Technology (PS)
Quantum Science and Technology (QS)
Spectroscopic Ellipsometry (EL)
Surface Science (SS)
Theory for Surface Processes and Spectroscopies (TH)
Thin Films (TF)
Undergraduate Posters (UN)
Vacuum Technology (VT)
2D Materials (2D)
  • 2D-TuM: 2D-Materials: Heterostructures and Functionalization
  • 2D+TF-TuA: 2D-Materials: Synthesis
  • 2D-WeM: 2D-Materials: Defects, Dopants, and Modifications
  • 2D-WeA: 2D-Materials: Electronic/Magnetic/Optical Properties
Learn More
  • 2D-ThM: 2D-Materials: Microscopy
  • 2D-ThA: 2D-Materials: Topological and Quantum Properties
  • 2D+EM-FrM: 2D-Materials: Device Application
  • 2D-ThP: 2D-Materials: Poster Session
Actinides and Rare Earths (AC)
  • AC+MI+TH-TuM: Magnetism, Electron Correlation, and Superconductivity in the Actinides/Rare Earths
  • AC+MI+TH-TuA: Chemistry and Physics of the Actinides/Rare Earths
  • AC+AS+TH-WeM: Nuclear Safeguards, Forensics, Environmental Science, and Stewardship
Learn More
  • AC+AS+MI+TH-WeA: Emerging Topics and Methods in Actinide/Rare Earth Sciences
  • AC-TuP: Actinides and Rare Earths Poster Session
Advanced Focused Ion Beams (IB)
  • IB-ThM: Advances in FIB Instrumentation, Source, Optics, and Surface Analysis
  • IB-ThA: In Situ FIB Applications
  • IB1-FrM: Advances in FIB Specimen Preparation
  • IB2-FrM: Advances in TEM and APT Specimen Preparation
Learn More
  • IB3-FrM: Beam-Induced Defect and Material Engineering
  • IB-ThP: Advanced Focused Ion Beams Poster Session
Advanced Surface Engineering (SE)
  • SE2+TF-MoM: Surface Engineering by Deposition of Protective Coatings
  • SE1+TF-MoM: Advanced Multi-Functional Thin Film Materials
Learn More
  • SE+TF-MoA: Mechanics and Tribology of Thin Films and Coatings
  • SE-TuP: Advanced Surface Engineering Poster Session
Applied Surface Science (AS)
  • AS+2D+CA+EL+EM+MS+NS+SE+SS+TF-WeM: Multi-Modal & Multi-Dimensional Analysis
  • AS+CA+EL+EM+SE+SS+TF-WeA: Quantitative Surface Analysis I
  • AS+CA+EL+EM+SE+SS+TF-ThM: Quantitative Surface Analysis II
Learn More
  • AS+2D+CA+EM+MS+NS+SE+SS+TF-FrM: Industrial Applications
  • AS-ThP: Applied Surface Science Poster Session
Atomic Scale Processing (AP)
  • AP+PS+TF-MoM: Thermal Atomic Layer Etching and Deposition
  • AP+PS-MoA: Plasma Enhanced Atomic Layer Etching
  • AP+EM+PS+TF-TuM: Area Selective Processing and Patterning
Learn More
  •  AP1+2D+EM+PS+TF-TuA: Atomic Layer Processing: Integration of Deposition and Etching
  • AP2+PS+TF-TuA: Energy Enhanced ALD
  •  AP+PS+TF-WeM: Plasma Deposition and ALD Processes for Coatings and Thin Films
Biomaterial Interfaces (BI)
  • BI1+PS-MoM: Microbes and Fouling at Surfaces
  • BI2+AS+HC+SS-MoM: Energy Transfer and Light-Induced Phenomena in Biologic Systems
  • BI1-MoA: SIMS and Orbi-SIMS Characterization of Biological and Biomaterials Surfaces
  • BI2-MoA: Functional Biomaterials I: Fabrication and Application
Learn More
  • BI+AS+PS-TuM: Biomolecules and Biophysics at Interfaces
  • BI+AS+EM+NS+SE+TF-TuA: Functional Biomaterials II: Sensing and Diagnostics
  • BI-TuP: Biomaterial Interfaces Flash Poster Session
Chemical Analysis and Imaging of Interfaces (CA)
  • CA1+AS+LS+NS+SS+VT-MoM: Modeling, AI, and Machine Learning Applied to Interfaces
  • CA2+AS+LS+NS+SS+VT+MoM: Environmental and Energy Interfaces
  • CA+AS+LS+NS+SS+VT-MoA: Environmental and Energy Interfaces
Learn More
  • CA+AS+LS+LX+MN+SE+SS-TuM: Novel Developments and Applications of Interfacial Analysis
  • CA-TuP: Chemical Analysis and Imaging of Interfaces Poster Session
CHIPS Act (CPS)
  • CPS+CA-WeA: CHIPS Act: Interfaces and Defects
  • CPS+MS-ThM: Chips and Science Act Implementation for Microelectronics (Including Workforce)
Electronic Materials and Photonics (EM)
  • EM-WeM: Advancements in Microelectronics and Nanotechnology by Early and Mid-Career Professionals
  • EM-WeA: Advanced Materials for Electronic and Photonic Applications
  • EM-ThA: Theme: CMOS+X: Piezoelectrics, Ferroelectrics, Multiferroics, and Memory
  • EM1-FrM: Emergent Photonic Materials and Devices for Mid-IR Applications
Learn More
  • EM2+TF-FrM: Advanced Patterning and Fabrication for Device Scaling
  • EM+TF-ThM: Wide- and Ultra-Wide Band Gap Materials and Devices
  • EM-ThP: Electronic Materials and Photonics Poster Session
Exhibitor Technology Spotlight (EW)
  • EW-TuL: Exhibitor Technology Spotlight Session I
Learn More
Fundamental Discoveries in Heterogeneous Catalysis (HC)
  • HC+SS-WeM: Origins of Single Atom Catalysis
  • HC+SS-WeA: Advances in Complex Catalytic Systems
  • HC+SS-ThM: Dynamics and Mechanisms in Heterogeneously Catalyzed Reactions
Learn More
  • HC+SS-ThA: Closing in on Reality
  • HC+SS-FrM: Greatest Hits in Heterogeneous Catalysis
  • HC-ThP: Fundamental Discoveries in Heterogeneous Catalysis Poster Session
Laboratory-Based Ambient-Pressure X-ray Photoelectron Spectroscopy (LX)
  • LX+AS+HC+SS-MoM: Laboratory-Based AP-XPS: Advances in Instrumentation and Applications
  • LX+AS+BI+HC+SS+TH-MoA: Laboratory-Based AP-XPS: Surface Chemistry and Biological/Pharmaceutical Interfaces
  • LX-TuP: Laboratory-Based AP-XPS: Poster Session
Learn More
Light Sources Sciences (LS)
  • LS+AC+AS+LX+MI+TH-ThA: Facility Upgrades and Recent Capability Development
  • LS+AC+LX+MI+TH-ThM: Tender X-ray Science and Time-Resolved Studies
Magnetic Interfaces and Nanostructures (MI)
  • MI+2D+TF-WeA: Special Symposium on Coupling Phenomena in Magnetism
  • MI+2D+TF-ThM: 2D Magnetism and Superconductivity
Learn More
Manufacturing Science and Technology (MS)
  • MS+AP+AS+TF-ThA: Machine Learning for Microelectronics Manufacturing Process Control
  • MS-FrM: Microelectronics R&D for Life-Cycle Energy Efficiency
  • MS-ThP: Manufacturing Science and Technology Poster Session
Learn More
MEMS and NEMS (MN)
  • MN1-WeM: MEMS Processes, Materials, and Fabrication
  • MN2-WeM: Nanomechanics
  • MN-ThP: MEMS/NEMS Poster Session
Learn More
Nanoscale Science and Technology (NS)
  • NS1+2D+BI+SS-MoM: Combined Nanoscale Microscopy
  • NS2+2D+BI+EL+SS-MoM: Chemical Identification with Scanning Probe Microscopy
  • NS+EM+MN-MoA: Nanoscale Devices, Structures and Materials
  • NS+2D+EM+MN+SS-TuM: Scanning Probe Microscopy
Learn More
  • NS2+2D+EM-TuA: Light-Matter Interactions at the Nanoscale
  • NS1+2D+EM+MN-TuA: Nanofabrication and Characterization of Low-Dimensional Materials
  • NS-TuP: Nanoscale Science and Technology Poster Session
Plasma Science & Technology (PS)
  • PS+TF-MoM Plasma Processing for Advanced Emerging Memory Technologies
  • PS+SE-MoA Plasma Sources, Diagnostics, Sensors and Control
  • PS-TuM: Plasma Processing for Advanced Logic Device Fabrications
  • PS+MS-TuA Modelling of Plasmas and Plasma Driven Processes
  • PS-WeM: Exploring Boundaries of Plasma Science: All invited talks including PSTD Award Lectures
  • PS1+AS-WeA Plasma Chemistry, Catalysis and Applications for the Environment and Sustainability
  • PS2+MS-WeA Plasma-Surface Modeling
Learn More
  • PS+NS-WeA Advanced Patterning and Plasma-Engineered Materials
  • PS1+MS-ThM AI/ML in Plasma Applications
  • PS2+AS+SS-ThM Plasma-Surface Interactions I
  • PS-ThA Plasma-Surface Interactions II
  • PS+SE-FrM Atmospheric Pressure Plasmas and Their Applications
  • PS-TuP: Plasma Science and Technology Poster Session
Quantum Science and Technology (QS)
  • QS+EM+TF-MoM: Materials for Quantum Computation and Quantum Information
  • QS-MoA: Systems and Devices for Quantum Computing
  • QS+EM-TuM: SiC, Diamond and Related Materials for Quantum Information Sciences
Learn More
  • QS+SS-TuA: The Quantum Metrology Revolution
  • QS+VT-WeM: Vacuum Technology for Quantum Applications
Spectroscopic Ellipsometry (EL)
  • EL1-MoM: Big Data, AI, and Analytical Methods
  • EL2-MoM: Industrial Applications of Spectroscopic Ellipsometry
  • EL1+TF-MoA: Thin Films & Novel Materials
Learn More
  • EL2-MoA: Instrumentation
  • EL-TuP: Spectroscopic Ellipsometry Poster Session
Surface Science (SS)
  • SS1+HC-MoM: Electrochemistry
  • SS2-MoM: Liquid-Solid Interfaces
  • SS+AS+TF-MoA: Mechanisms at Surfaces and Interfaces
  • SS+2D+AS+HC-TuM: Oxide and Chalcogenide Surfaces and Interfaces
  • SS+HC-TuA: Photochemistry
  • SS+2D+AS+HC-WeM: Surface Science of 2D Materials
Learn More
  • SS-WeA: A Special Session Honoring Wilson Ho: 25 Years of Single-Molecule Vibrational Spectroscopy and Microscopy
  • SS2+AS+TF-ThM: Thin Film Surface Chemistry
  • SS1+AS-ThM: Molecular Organization at Surfaces
  • SS+HC-ThA: Alloys and Complex Surfaces
  • SS-ThP: Surface Science Poster Session
Theory for Surface Processes and Spectroscopies (TH)
  • TH1+AS+SS-TuM: Introduction and Core-Level Spectroscopies I
  • TH2+AS+SS-TuM: Core-Level Spectroscopies II
  • TH1-TuA: Electronic Structure Theory
Learn More
  • TH2-TuA: Electronic Structure and Reactivity
  • TH-TuP: Theory for Surface Processes and Spectroscopies Poster Session
Thin Films (TF)
  • TF1-TuA: Catalytic and Active Materials
  • TF2-TuA: Thin Films for Battery Applications
  • TF1+PS-WeM: Emerging and Advanced Materials and Processes
  • TF2+AP+SE+SS-WeM: Controlling Microstructure and Accessing Non-Equilibrium Phases in Thin Films
  • TF+QS-WeA: Thin Films for Space and Electronic Applications
Learn More
  • TF-ThM: Creating Organic-Inorganic Hybrid Materials
  • TF-ThA: Organic and Polymeric Materials
  • TF+SE-FrM: Metal-Organic Frameworks and Other Network Materials
  • TF18+AP: Manufacturing and Scale-Up of CVD and (Spatial) ALD
  • TF-ThP: Thin Film Poster Session
Undergraduate Posters (UN)
  • UN1: Undergraduate Poster Session

 

Learn More

Vacuum Technology (VT)
  • VT-MoM: Vacuum Measurement, Partial Pressure, and Gas Analysis
  • VT-MoA: Leaks, Flows, and Material Outgassing
  • VT-TuM: Particle Accelerators and Large Vacuum Systems
Learn More
  • VT-TuA: Novel Vacuum Instrumentation
  • VT-TuP: Vacuum Technology Poster Session

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Key Dates

Major Awards Deadline:
March 31, 2023

Student Awards Deadline:
May 31, 2023

Call for Late-Breaking Abstracts Deadline:
September 15, 2023

Early Registration Deadline:
October 2, 2023

Housing/Hotel Extended Deadline:
October 18, 2023

Contact

Yvonne Towse
Conference Administrator
125 Maiden Lane; Suite 15B
New York, N.Y. 10038
yvonne@avs.org

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