The MEMS and NEMS Technology Group (MN) program will highlight recent advances in the broad areas of micro/nanoelectromechanical systems (MEMS/NEMS), especially the latest fundamental studies of novel materials, processes, devices, and emerging functions and applications of MEMS/NEMS, in various areas. Our program will include resonant low-dimensional materials and parametric and nonlinear MEMS/NEMS resonators which create intriguing possibilities of integrating these devices with existing fluidic, electronic, and optical on-chip networks.
The program continues to embrace the latest progresses in optical MEMS/ NEMS, micro/nanophotonics, optomechanics, quantum MEMS/NEMS, resonant systems, CMOS-MEMS, mesoscopic dynamics, and dissipation processes, inertial sensors, harsh-environment transducers, and MEMS/NEMS-enabled energy technologies, etc. It also aims to capture some of the latest advances in soft materials, flexible and implantable MEMS/NEMS for biosensing, bio-inspired microsystems, and wearable and wireless healthcare.
MN1+QS: Optomechanics and Quantum Phononics
- Xiyuan Lu, National Institute of Standards and Technology (NIST)/ University of Maryland, College Park, “Integrated Silicon Carbide Optomechanical Micro-/Nano-Resonators”
- Benjamín Alemán, University of Oregon, “Spatial Mapping and Analysis of Graphene Nanomechanical Resonator Networks”
MN3: 2.5D/3D Heterogeneous Integration, High Aspect Ratio Structures, and Advanced Packaging
MN4: Radio Frequency MEMS
- Vikrant Gokhale, Naval Research Laboratory, USA, “Epitaxial Materials and Devices for High-Performance Acoustics”
MN5: MEMS and BioMEMS: Processes, Materials, and Fabrication
- Robert Roberts, University of Texas at El Paso, “Additive Manufacturing for 3D Metal Microsystems”
MN6: MEMS/NEMS Poster Session