Abstract Deadline May 10, 2023
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Division: Thin Film (TF)

Home Division: Thin Film (TF)

The Thin Film Division (TF) offers several oral sessions and one poster session. The program will broadly cover thin film fundamentals, materials, processing, and applications. Processing techniques to be highlighted include ALD, CVD, HiPIMS, and other vapor deposition technologies. Sessions related to ALD/ALE and area selective patterning are directly aligned with the Atomic Scale Processing (AP) Focus Topic. We offer sessions dedicated to precursor and process development for 3D, high-aspect-ratio architectures, and nanostructured materials. We encourage contributions related to thin film applications in batteries, semiconductor devices, space technologies, superconductors, and quantum computing. We offer sessions on theory, modeling, artificial intelligence, and machine learning for material design and semiconductor manufacturing. We solicit abstracts for in-situ studies of thin films, surfaces, and interface as well as strategies for manipulating microstructures and accessing non-equilibrium phases in thin films. To address the emerging areas of thin film research, we are offering sessions on organic-inorganic hybrid materials and polymeric films as well as metal-organic frameworks and other network materials. Again this year, we will host the popular student-focused session in which Harper Award finalists will share their work in interactive “TED-Talk” style presentations.

TF1+AP: Novel ALD/CVD Precursors and Processes for High Aspect Ratio Architectures

  • Riikka Puurunen, Aalto University, Finland

TF2: Growth in 3D, High Aspect Ratio, and Nanostructured Materials

  • Mikhael Bechelany, Institut Européen des Membranes, France, “Membrane Design by Atomic Layer Deposition”

TF3+EM: Materials Challenges in 3D Memory

  • Johan Swerts, IMEC, Belgium

TF4+MS: AI and ML for Materials and Semiconductor Manufacturing

  • Kanad Basu, University of Texas at Dallas, “Machine Learning-based Atomic Layer Deposition”

TF5+AP: Thermal Atomic Layer Etching

TF6+AP+EM+PS: Area Selective Processing + Patterning

  • Cathleen Crudden, Queen’s University, Canada, “Area selective ALD employing small molecule inhibitors with carbon as the heteroatom equivalent”

TF7+AP: Atomic Layer Processing: Integration of Deposition and Etching

TF8+AP+PS: Energy Enhanced ALD

  • Andrew Kummel, University of California at San Diego

TF9+PS: HiPIMS for Emerging and Advanced Materials

  • Stephen Stagon, University of North Florida

TF10+AP+SE+SS: In-situ Studies of Thin Films, Surfaces, and Interfaces

  • Ashley Bielinski, Argonne National Laboratory, “Measuring the Time-Resolved Heat of ALD Surface Reactions”

TF11+EM: Thin Film for Superconductors and Quantum Computing

  • Bharat Jalan, University of Minnesota, “Engineering Metal Oxidation Using Epitaxial Strain”

TF12: Thin Films for Space Applications

  • Frank Greer, Jet Propulsion Laboratory (NASA/JPL), “Atomic Scale Processing and Surface Engineering to Maximize Microdevice Performance for Remote Sensing and Imaging Applications”

TF13: Thin Films for Battery Applications

  • Mark Huijben, University of Twente, Netherlands, “Superior Microbatteries by Tailoring Epitaxial Interfaces”

TF14: Vapor Deposition and Vapor Infiltration for Creating Organic-Inorganic Hybrid Materials

  • Diana Berman, University of North Texas, “Functional Ceramic Heterostructures via Vapor and Liquid Phase Infiltration of Polymer Templates”

TF15: Vapor Deposition of Organic and Polymeric Materials

  • Joerg Lahann, University of Michigan, “Nanofiber-Decorated Surfaces via LC Templated CVD Polymerization”

TF16+SE: Vapor-phase Processes for Depositing or Modifying Metal-Organic Frameworks or Other Network Materials

  • Ola Nilsen, University of Oslo, Norway, “Vapor-phase Processes for Depositing or Modifying Metal-Organic Frameworks or Other Network Materials”

TF17: Controlling Microstructure and Accessing Non-Equilibrium Phases in Thin Films

  • Lauren Garten, Georgia Institute of Technology

TF18+AP: Manufacturing and Scale-Up of CVD and (Spatial) ALD

  • Maksym Plakhotnyuk, ATLANT 3D Nanosystems, Denmark

TF19: Thin Film Poster Session

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Key Dates

Major Awards Deadline:
March 31, 2023

Student Awards Deadline:
May 31, 2023

Call for Abstracts Deadline:
May 10, 2023

Early Registration Deadline:
TBD

Hotel Deadline Extension:
TBD

Contact

Yvonne Towse
Conference Administrator
125 Maiden Lane; Suite 15B
New York, N.Y. 10038
yvonne@avs.org

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