Abstract Deadline May 10, 2023
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Focus Topic: Atomic Scale Processing (AP)

Home Focus Topic: Atomic Scale Processing (AP)

The Atomic Scale Processing Focus Topic is aimed to provide a unique forum to expand the scope of atomic layer deposition (ALD) and atomic layer etching (ALE) processes toward understanding the fundamentals needed to achieve true atomic scale precision and the application of such processing on various areas of interest to the broader AVS community. The emphasis will be on synergistic efforts, across multiple AVS divisions and groups, to generate area-selective processes as well as novel characterization methods to advance the field of processing at the atomic scale. We are excited to offer several sessions in collaboration with Plasma Science & Technology Division, the Thin Film Division as well as the Electronic Materials and Photonics Division focusing on area selective deposition, atomic layer process chemistry and surface reactions, and atomic layer etching.

AP1+EM+PS+TF: Area Selective Processing and Patterning

  • Yukio Kaneda, Sony Semiconductor Solutions Corporation, Japan, “A Study of Elucidation and Improvement of TiO2 Selectivity by First-Principles Based Thermodynamic Simulation”

AP2+EL+SS: Advancing Metrology and Characterization to Enable Atomic Scale Processing

  • Alain Diebold, College of Nanoscale Science and Engineering, “Optical and X-Ray Characterization and Metrology of Si/Si(1-x)Ge(x) Nanoscale Superlattice Film Stacks and Structures”

AP3+EM+TF: Beam Studies / Surface Reaction Analysis and Emerging Applications of Atomic Scale Processing

AP4+PS+TF: Thermal Atomic Layer Etching

  • John Hennessy, Jet Propulsion Laboratory (NASA/JPL)

AP5+2D+EM+PS+TF: Atomic Layer Processing: Integration of Deposition and Etching

  • Annelies Delabie, IMEC, Belgium, “Mechanisms of Area-Selective Deposition in Nanoscale Patterns”

AP6+PS: Plasma Enhanced Atomic Layer Etching

  • Remi Dussart, Orleans University, France, “Mechanisms And Benefits of Cryogenic Atomic Layer Etching of Silicon Compounds”

AP7+TF: Novel ALD/CVD Precursors and Processes for High Aspect Ratio Architectures

  • Riikka Puurunen, Aalto University, Finland

AP8+EM+PS+TF: Atomic Scale Processing Poster Session

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Key Dates

Major Awards Deadline:
March 31, 2023

Student Awards Deadline:
May 31, 2023

Call for Abstracts Deadline:
May 10, 2023

Early Registration Deadline:
TBD

Hotel Deadline Extension:
TBD

Contact

Yvonne Towse
Conference Administrator
125 Maiden Lane; Suite 15B
New York, N.Y. 10038
yvonne@avs.org

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