The Plasma Science & Technology (PS) program highlights state-of-the-art advances in plasma science and associated applications, ranging from fundamental studies of plasma physics and chemistry, and plasma-matter interactions to new and advanced applications in plasma processing. Our diverse international community includes researchers from academia, national laboratories, and industry covering topics extending from the latest advancements in basic and applied research for established fields such as semiconductor fabrication to novel and emerging applications, where plasma is either the focus or the enabling tool. One of the exciting features of this year’s program is that we have been able to invite back some of the prominent PSTD students from years past to give updates on current plasma research. The program extends over the entire week and includes oral sessions in the morning and afternoon. Each session includes one or more invited lectures given by a well-recognized subject matter expert along with numerous contributed talks. The program will also feature talks by the PSTD Plasma Prize and Young Investigator Award winner along with student finalists for this year’s Coburn and Winters Award. In addition, the Plasma Division will seek to form joint sessions with other focus groups, divisions, and groups at AVS, with the aim of exposing our community to new areas and also drawing a wider audience to our Plasma topics. Special consideration will be given to papers that emphasize issues that are cross-disciplinary in nature. Abstracts with a preview of results and conclusions supported by technical data are favored for oral presentation. Original abstracts are solicited on the following topics, but not limited to:
PS1: Advanced BEOL: Interconnect Materials and Etching
- Eric Liu, TEL Technology Center America, “Technology Options to Enable Logic Scaling in Advanced Beol from Patterning to Metal Interconnect Formation”
PS2+AP: Advanced FEOL: Plasma Processing for Logic Devices
- Yun Han, TEL Technology Center America, “FEOL Plasma Etch Challenges in 3D Logic Device Fabrication”
PS3+NS: Advanced Patterning: EUV, Multipatterning, and Alternative Patterning Approaches (Imprint, DSA, etc.)
- Danilo De Simone, IMEC, Belgium
PS4+TF: Plasma Processing for Advanced Emerging Memory Technologies
- Thorsten Lill, Lam Research Corp., “Etching of High Aspect Ratio Structures at Low Temperatures: Fundamentals and Applications”
PS5+TF: Plasma Processing for Advanced Packaging and Heterogeneous Integration
- Thierry Chevolleau, CEA-Leti, France, “Plasma Etching Processes for Advanced Memory Technologies”
PS6+TF: Plasma-engineered Materials and Other Materials Processing: Power Electronics, III-V, Solar Cells, Quantum Computing, Optoelectronics, MEMS, and AR/VR
- Shin Mou, Air Force Research Laboratory
PS7+AP: Plasma Assisted Atomic Layer Etching
- Wenbin Yang, Lam Research Corporation, “Atomic Layer Etching for High Aspect Ratio Etch Applications”
PS8+AP+TF: Plasma Deposition and ALD Processes for Coatings and Thin Films
- Marceline Bonvalot, University of Grenoble, France, “Combination of Plasma-Based Atomic Scale Deposition and Etching Processes for Advanced Patterning”
- Nobuyuki Kuboi, Sony Semiconductor Solutions Corporation, Japan, “Prediction and Control of Coverage and Film Property on Deposition Process”
PS9+SE: Plasma Sources
- Christine Charles, Australian National University, Australia, “From Space Thrusters to Exoplanets Research”
PS10+SE: Plasma Diagnostics, Sensors, and Control
- Steven Shannon, North Carolina State University, “Expanding the Capabilities of Microwave Hairpin Probes”
PS11+MS: Modelling of Plasmas and Plasma-Driven Processes
- Kallol Bera, Applied Materials, “RF Hollow Cathode Discharge Characterization using Plasma and Machine Learning Models”
PS12+MS: Plasma-Surface Modeling
- David Graves, Princeton University Plasma Physics Lab, “Modeling and Simulation of Plasma-Surface Interactions in Nanofabrication”
- Du Zhang, TEL Technology Center America, “Driving Technological Advancements in Plasma Etching Through Simulation-Informed Plasma-Surface Interaction Engineering”
PS13+MS: AI/ML in Plasma Applications
- Tetsuya Nishizuka, Tokyo Electron Ltd., Japan, “Approaches to Virtual Etch Process Experiment and Optimization in High Aspect Ratio Patterning”
PS14+AS+SS: Plasma-Surface Interactions
- Peter Bruggeman, University of Minnesota, “Plasma-Surface Interactions At Atmospheric Pressure: From Liquids To Catalytic Surfaces”
- John Daugherty, Lam Research Corp., “Plasma-wall Materials Interactions: Implications for Advanced Chamber Design”
- Satoshi Hamaguchi, Osaka University, Japan, “How Machine Learning Can Help Process Development”
PS15: Plasmas for the Environment and Sustainability
- Olivier Guaitella, LPP, France
PS16+AS: Plasma Catalysis
- Elijah Thimsen, Washington University in St. Louis, “Synthesis of Hydrogen and Structural Carbon Materials from Methane Using Radiofrequency Nonequilibrium Plasma”
PS17+AS: Plasma Chemistry
- Alex Fridman, Drexel University, “Plasma Chemistry in Atmospheric Pressure Gases and Liquids: Fundamental and Novel Applications”
PS18+SE: Atmospheric Pressure Plasmas and Their Applications
- Judith Golda, Ruhr University Bochum, Germany, “Fundamentals of kHz Discharges for Plasma Catalytic Applications”
PS19: Special Topics for AVS PSTD
- Luxherta Buzi, IBM T. J. Watson Research Center, “Plasma Processing Challenges for Emerging Memory Technology”
- Eric Joseph, IBM T. J. Watson Research Center
- Scott Walton, Naval Research Laboratory, “Electron Beam Driven Plasmas: Development, Characterization, and Application”
- Geun Young Yeom, Sungkyunkwan University (SKKU), Korea (Democratic People’s Republic of), “Vhf Plasma Enhanced Atomic Layer Deposition of Sinx Using Aminosilane Precursors”
PS20: Plasma Science and Technology Poster Session