Call for Abstracts Deadline:
Abstract Submission Guidelines
Please review Steps 1-5 below before entering the online abstract submission site.
Step 1
Before signing up or logging into the online system (in Step 5), please review all of the following steps to ensure you have the information needed to complete the abstract submission process.
Please Note the Following Requirements Prior to Submission:
- If you are planning to submit multiple abstracts, presenters are limited to one oral and one poster presentation.
- If you already have accepted abstracts scheduled in the program, please note that you can only have one oral and one poster in the program total so please keep this in mind when submitting a late breaking abstract.
Step 2
Select a a session topic from the list below. Note that all sessions have Late Breaking Oral, Late Breaking Poster, and Late Breaking On Demand submission options (except the undergraduate poster session)
Step 3
Fill out the abstract content and author details in the system (abstract 2,700 characters max. including grammar and spacing; you may also submit a supplemental 1 page PDF file containing any graphs, charts or pictures you wish to include).
Step 4
Agree to the copyright agreement. If you have questions e-mail yvonne@avs.org.
STEP 5
Due by 11:59 p.m. ET
Author Notification
Acknowledgment that your abstract has been submitted will follow by e-mail shortly after submission with official acceptance/scheduling emails to be sent by early August. The Call for Late Breaking submissions will launch in early August and acceptance/scheduling notifications will be emailed in mid-September.
Topics
2D Materials (2D)
- 2D1+TF: 2D Materials: Synthesis and Processing
- 2D2: 2D Materials: Electron Microscopy
- 2D3: 2D Materials: Scanning Probe Microscopy and Photoemission Spectroscopy
- 2D4: 2D Materials: Electronic, Mechanical, and Optical Properties
- 2D5: 2D Materials: Charge Density Waves, Magnetism, and Superconductivity
- 2D6: 2D Materials: Defects, Dopants, Edges, Functionalization, and Intercalation
- 2D7: 2D Materials: Heterostructures, Twistronics, and Proximity Effects
- 2D8: 2D Materials: Catalysis, Energy, and Environment
- 2D9: 2D Materials: Biological Interfaces
- 2D10: Quantum Effects in 2D Materials: Ferroelectricity and Quantum Spin Liquid
- 2D11: 2D Materials: Sensors and Devices
- 2D12: 2D Materials Poster Session
Actinides and Rare Earths (AC)
- AC1+MI+TH: Magnetism, Electron Correlation, and Superconductivity in the Actinides/Rare Earths
- AC2+MI+TH: Chemistry and Physics of the Actinides/Rare Earths
- AC3+AS+MI+TH: Emerging Topics and Methods in Actinide/Rare Earth Sciences
- AC4+AS+TH: Nuclear Safeguards, Forensics, Environmental Science, and Stewardship
- AC5+MI+TH: Actinide/Rare Earth Theory
- AC6+LX+MI+TH: Tender X-ray Science
- AC7+TH: Time-resolved Studies
- AC8+AS+LX+MI+TH: Facility Upgrades
- AC9+AS+LX+MI+TH: Recent Capability Development
- AC10: Actinides and Rare Earths Poster Session
Advanced Focused Ion Beams (IB)
- IB1: Advances in FIB instrumentation, Ion Sources and Optics
- IB2: Beam Induced Material Engineering and Nano Patterning
- IB3: In Situ FIB Applications
- IB4: Advanced Ion Microscopy and Surface Analysis
- IB5: Advances in TEM and APT Specimen Preparation
- IB6: Ion Beam Imaging, Cross-sectioning and Tomography
- IB7: Advanced Focused Ion Beams Poster Session
Advanced Surface Engineering (SE)
- SE1+TF: Advanced Multi-Functional Thin Film Materials
- SE2+TF: Surface Engineering by Deposition of Protective Coatings
- SE3+TF: Mechanics and Tribology of Thin Films and Coatings
- SE: Advanced Surface Engineering Poster Session
- SE+MN+PS-FrM: Nanostructured and Multifunctional Thin Films and Coatings II
- SE-ThP: Advanced Surface Engineering Poster Session
Applied Surface Science (AS)
- AS1+CA+EL+EM+SE+SS+TF: Quantitative Surface Analysis
- AS2+2D+CA+EM+MS+NS+SE+SS+TF: Multi-Modal & Multi-Dimensional Analysis
- AS3+2D+CA+EM+MS+NS+SE+SS+TF: Power Storage & Green Energy
- AS4+2D+CA+EM+NS+SE+SS+TF: Modelling in Applied Surface Analysis
- AS5+2D+CA+EM+MS+NS+SE+SS+TF: Industrial Applications
- AS6+CA+EL+EM+SE+SS+TF: Quantitative Surface Analysis
- AS7+2D+CA+EM+MS+NS+SE+SS+TF: Multi-Modal & Multi-Dimensional Analysis
- AS8+2D+CA+EM+MS+NS+SE+SS+TF: Power Storage & Green Energy
- AS9+2D+CA+EM+MS+NS+SE+SS+TF: Modelling in Applied Surface Analysis
- AS10+2D+CA+EM+MS+NS+SE+SS+TF: Industrial Applications
- AS11: Applied Surface Science Poster Session
Atomic Scale Processing (AP)
- AP1+EM+PS+TF: Area Selective Processing and Patterning
- AP2+EL+SS: Advancing Metrology and Characterization to enable Atomic Scale Processing
- AP3+EM+TF: Beam Studies / Surface Reaction Analysis and Emerging Applications of Atomic Scale Processing
- AP4+PS+TF: Thermal Atomic Layer Etching
- AP5+2D+EM+PS+TF: Atomic Layer Processing: Integration of Deposition and Etching
- AP6+PS: Plasma Enhanced Atomic Layer Etching
- AP7+TF: Novel ALD/CVD Precursors and Processes for High Aspect Ratio Architectures
- AP8+EM+PS+TF: Atomic Scale Processing Poster Session
Biomaterial Interfaces (BI)
- BI1+PS: Microbes and Fouling at Surfaces
- BI2+AS+PS: Biomolecules and Biophysics at Interfaces
- BI3: Characterization of Biological and Biomaterials Surfaces
- BI4+AS+EM+NS+SE+TF: Bioanalytics, Biosensors and Diagnostics
- BI5: Biomaterials and Nanomaterials Fabrication
- BI6+AS+HC+SS: Energy Harvesting in Biologic Systems
- BI7: Simulation of Biointerfaces and Biomaterials
- BI8: Emerging Topics in Biointerface Sciences (by invitation only in collaboration with Biointerphases)
- BI9: Biomaterial Interfaces Flash Poster Session
Chemical Analysis and Imaging of Interfaces (CA)
- CA1: Environmental Interfaces
- CA2: In Situ Microscopy, Spectroscopy, and Processing at Liquid-Solid-Gas Interfaces
- CA3: CHIPS Act: Interfaces and Defects
- .CA4: Modeling of Multi-Dimensional Data of Interfacial Processes
- CA5: Progress and Challenges in Industrial Applications
- CA6: Developments and Applications of Interfacial Analysis Novel
- CA7: Chemical Analysis and Imaging at Interfaces Poster Session
Electronic Materials and Photonics (EM)
- EM1: Advanced Materials for Electronic and Photonic Applications
- EM2: Theme: Advanced Materials for Straintronics
- EM3: Theme: CMOS+X: Piezoelectrics, Ferroelectrics and Multiferroics
- EM4: CMOS+X: Emerging Memory Technologies
- EM5: Theme: Recent Advancement in Transparent Conductors
- EM6: Materials for Quantum Computation and Quantum Information
- EM7+TF: Wide- and Ultra-Wide Band Gap Materials and Devices
- EM8: Emergent Photonic Materials and Devices for Mid-IR Applications
- EM9+TF: Advanced Patterning and Fabrication for Device Scaling
- EM10: Materials and Device Advances for Neuromorphic Computing
- EM11: Materials and Devices to Advance AI, and AI to Advance Materials and Devices
- EM12: Advancements in Microelectronics and Nanotechnology by Early Career Professionals
- EM13: Electronic Materials and Photonics Poster Session
Exhibitor Technology Spotlight (EW)
- EW1: Exhibitor Technology Spotlight Session I
Fundamental Discoveries in Heterogeneous Catalysis (HC)
- HC1: Origin of Single Atom Catalysis
- HC2: Advances in Size-Controlled Catalysts
- HC3: Electro Catalysis
- HC4: Closing in on Reality
- HC5: Dynamics and Mechanisms in Heterogeneously Catalyzed Reactions
- HC6: Heterogeneous Catalysis in Energy Applications
- HC7: Advances of Theory in Heterogeneous Catalysis
- HC8: Model Catalysis and Materials Characterization
- HC9: Fundamental Discoveries in Heterogeneous Catalysis Poster Session
Laboratory-Based Ambient-Pressure X-ray Photoelectron Spectroscopy (LX)
- LX1+AS+SS: Laboratory-Based AP-XPS: Instrumentation Development
- LX2+AS+HC+SS: Laboratory-Based AP-XPS: Applications towards Catalysis
- LX3+AS+HC+SS+TH: Laboratory-Based AP-XPS: Combination of Experiment with Theory
- LX4+AS+BI+SS: Laboratory-Based AP-XPS: Characterization of Porous Materials and Liquids
- LX5+AS+BI+BP+SS: Laboratory-Based AP-XPS: Understanding Biological and Pharmaceutical Interfaces
- LX6+AS+BI+SS: Laboratory-Based AP-XPS: Poster Session
Magnetic Interfaces and Nanostructures (MI)
- MI1+2D+TF: Interplay of Exchange and Spin-Orbit Interaction for Spin Manipulation
- MI2+2D+TF: 2D Magnetism and Superconductivity I
- MI3+2D+TF: 2D Magnetism and Superconductivity II
- MI4+2D+TF: Special Symposium on “Light and Spin”
- MI5+2D+TF: Magnetic Interfaces and Nanostructures Poster Session
Manufacturing Science and Technology (MS)
- MS1: Chips and Science Act Implementation for Microelectronics (Including Workforce)
- MS2: Machine Learning for Microelectronics Manufacturing Process Control
- MS3: Microelectronics R&D for Life-cycle Energy Efficiency
- MS4: Manufacturing Science and Technology Poster Session
MEMS and NEMS (MN)
MN1+QS: Optomechanics and Quantum Photonics
MN2: Nanomechanics
MN3: 2.5D/3D Heterogeneous Integration, High Aspect Ratio Structures, and Advanced Packaging
- MN4: Radio Frequency MEMS
- MN5: MEMS and BioMEMS: Processes, Materials, and Fabrication
- MN6: MEMS/NEMS Poster Session
Nanoscale Science and Technology (NS)
- NS1+2D+EM: Light-Matter Interactions at the Nanoscale
- NS2+2D+MN: Quantum Systems and Devices for Novel Sensing Applications
- NS3+2D+BI+EM+MI+MN: Nanoscale Materials, Devices, and Structures (Including Synthesis, Fabrication, and Characterization)
- NS4+EM+MN: Nanophotonics, Metamaterials, and Plasmonic Systems for Quantum Applications
- NS5+2D+EM+MN: Nanofabrication and Characterization of Low-Dimensional Materials
- NS6+2D+EM+MN+SS: Scanning Probe Microscopy (Techniques and Data Processing)
- NS7+2D+QS: Scanning Probe Microscopy Studies on Quantum Materials
- NS8+2D+EM+TF: Nanoscience and Technology Aspects of Energy Research
- NS9+2D+EM+MI: Mixed-Dimensional Novel Material Heterostructures
- NS10: on-Surface Reactions Studies by Scanning Probe Microscopy
- NS11+MN: Nanoscale Measurement Quality
- NS12+2D+BI+SS: Combined Nanoscale Microscopy
- NS13+2D+BI+EL+SS: Chemical Identification with Scanning Probe Microscopy
- NS14: Nanoscale Science and Technology Poster Session
Plasma Science & Technology (PS)
PS1: Advanced BEOL: Interconnect Materials and Etching
PS2+AP: Advanced FEOL: Plasma Processing for Logic Devices
PS3+NS: Advanced Patterning: EUV, Multipatterning and Alternative Patterning Approaches (Imprint, DSA, etc.)
PS4+TF: Plasma Processing for Advanced Emerging Memory Technologies
PS5+TF: Plasma Processing for Advanced Packaging and Heterogeneous Integration
PS6+TF: Plasma-engineered Materials and Other Materials Processing: Power Electronics, III-V, Solar Cells, Quantum Computing, Optoelectronics, MEMS, and AR/VR
PS7+AP: Plasma Assisted Atomic Layer Etching
PS8+AP+TF: Plasma Deposition and ALD Processes for Coatings and Thin Films
PS9+SE: Plasma Sources
PS10+SE: Plasma Diagnostics, Sensors, and Control
- PS11+MS: Modelling of Plasmas and Plasma-Driven Processes
- PS12+MS: Plasma-Surface Modeling
- PS13+MS: AI/ML in Plasma Applications
- PS14+AS+SS: Plasma-Surface Interactions
- PS15: Plasmas for the Environment and Sustainability
- PS16+AS: Plasma Catalysis
- PS17+AS: Plasma Chemistry
- PS18+SE: Atmospheric Pressure Plasmas and Their Applications
- PS19: Special Topics for AVS PSTD
- PS20: Plasma Science and Technology Poster Session
Quantum Science and Technology (QS)
- QS1: Systems and Devices for Quantum Information
- QS2: Systems and Devices for Quantum Computing
- QS3: High Coherence Qubits for Quantum Computing
- QS4: SiC, Diamond and Related Materials for Quantum Information Sciences
- QS5: The Quantum Metrology Revolution
- QS6: Quantum Science and Technology Poster Session
Spectroscopic Ellipsometry (EL)
- EL1: Industrial Applications of Spectroscopic Ellipsometry
- EL2: Big Data, AI, and Analytical Methods
- EL3+TF: Thin Films & Novel Materials
- EL4: Instrumentation
- EL5: Spectroscopic Ellipsometry Poster Session
Surface Science (SS)
- SS1+AS+TF: Mechanisms at Surfaces and Interfaces
- SS2+AS+HC+TF: Overcoming Barriers in Dynamic Processes
- SS3+2D+AS: Surface Science of 2D Materials
- SS4+AS+CA: Environmental and Atmospheric Surfaces
- SS5+HC: Photochemistry
- SS6+HC: Electrochemistry
- SS7: Liquid-Solid Interfaces
- SS8+2D+AS+HC: Oxide and Chalcogenide Surfaces and Interfaces
- SS9+2D+AS+HC: Oxide and Chalcogenide Reactivity
- SS10+AS+TF: Thin Film Surface Chemistry
- SS11+AS: Molecular Organization at Surfaces
- SS12+HC: Alloys and Complex Surfaces
- SS13: A Special Session Honoring Wilson Ho
- SS14: Surface Science Poster Session
Theory for Surface Processes and Spectroscopies (TH)
- TH1+AS+SS: Introduction and Core-Level Spectroscopies I
- TH2: Core-Level Spectroscopies II
- TH3: Electronic Structure Theory
- TH4: Electronic Structure and Reactivity
- TH5: Theory for Surface Processes and Spectroscopies Poster Session
Thin Films (TF)
- TF1+AP: Novel ALD/CVD Precursors and Processes for High Aspect Ratio Architectures
- TF2: Growth in 3D, High Aspect Ratio, and Nanostructured Materials
- TF3+EM: Materials Challenges in 3D Memory
- TF4+MS: AI and ML for Materials and Semiconductor Manufacturing
- TF5+AP: Thermal Atomic Layer Etching
- TF6+AP+EM+PS: Area Selective Processing + Patterning
- TF7+AP: Atomic Layer Processing: Integration of Deposition and Etching
- TF8+AP+PS: Energy Enhanced ALD
- TF9+PS: HiPIMS for Emerging and Advanced Materials
- TF10+AP+SE+SS: In-situ Studies of Thin Films, Surfaces, and Interfaces
- TF11+EM: Thin Film for Superconductors and Quantum Computing
- TF12: Thin Films for Space Applications
- TF13: Thin Films for Battery Applications
- TF14: Vapor Deposition and Vapor Infiltration for Creating Organic-Inorganic Hybrid Materials
- TF15: Vapor Deposition of Organic and Polymeric Materials
- TF16+SE: Vapor-phase Processes for Depositing or Modifying Metal-Organic Frameworks or Other Network Materials
- TF17: Controlling Microstructure and Accessing Non-Equilibrium Phases in Thin Films
- TF18+AP: Manufacturing and Scale-Up of CVD and (Spatial) ALD
- TF19: Thin Film Poster Session
Vacuum Technology (VT)
- VT1: Vacuum Measurement, Partial Pressure, and Gas Analysis
- VT2: Vacuum Pumping and Extreme High Vacuum
- VT3: Gas Dynamics, Modeling, and Simulation
- VT4: Leaks, Flows, and Material Outgassing
- VT5: Aerospace and Large Vacuum Systems
- VT6: Particle Accelerators
- VT7: Particle Control, Quality Control, Ultraclean Systems
- VT8: Vacuum Technology for Quantum applications
- VT9: Vacuum Technology for Fusion Research
- VT10: Two is Better than One: Coupled Phenomena
- VT11: Environmentally Sustainable Vacuum Technology
- VT12: Vacuum Technology Poster Session