The Plasma Science & Technology (PSTD) program highlights state-of-the-art advances in plasma science and associated applications, ranging from fundamental studies of plasma physics and chemistry, and plasma-matter interactions to new and advanced applications in plasma processing. Our diverse international community includes researchers from academia, national laboratories, and industry covering topics extending from the latest advancements in basic and applied research for established fields such as semiconductor fabrication to novel and emerging applications, where plasma is either the focus or the enabling tool.
The program extends over the entire week and includes oral sessions in the morning and afternoon. We start our week by talks on plasmas for memory device fabrications and plasma sources, diagnostics, sensors, and control. On Tuesday, we will cover plasmas for logic device fabrications and modelling of plasmas and plasma-driven processes. On Wednesday afternoon, we will expand our program into two parallel sessions throughout the week, where you will find topics associated with plasma chemistry, catalysis and applications for the environment and sustainability; surface modeling of plasma applications; machine learning; plasma-surface interactions; the development and applications of atmospheric pressure plasmas; advanced patterning and plasma-engineered materials. On Wednesday morning, we will host one single session highlighting recent advances in plasmas for semiconductor applications as well as a special session highlighting Plasma talks from National awards (Walton, Joseph, Yeom – 2022 AVS fellow) and Divisional Young Investigator Award (Buzi – 2022 YI award). Folks interested in other applications may find the Atomic Scale Processing (AP) Mini-Symposium or the Quantum Science and Technology (QS) Mini-Symposium on Monday through Wednesday morning, or Manufacturing Science and Technology (MS) on Thursday afternoon and Friday morning interesting as well. Our poster session on Tuesday covers all topics noted above in a relaxed environment conducive to extended discussion with the presenters.
Each session includes one or more invited lectures given by a well-recognized subject matter expert along with numerous contributed talks. The program will also feature talks by the PSTD student finalists for this year’s Coburn and Winters Award.
PS+TF-MoM Plasma Processing for Advanced Emerging Memory Technologies
- Thierry Chevolleau, CEA-LETI, France, “Plasma Etching Processes Challenges in Emerging Non-Volatile Memories”
- Thorsten Lill, Clarycon Nanotechnology Research, Inc., “Enhancing Etching Processes at Lower Wafer Temperatures: New Insights into Chemical and Physical Mechanisms”
PS+SE-MoA Plasma Sources, Diagnostics, Sensors and Control
- Steven Shannon, North Carolina State University, “5 Expanding the Capabilities of Microwave Hairpin Resonator Probes”
PS-TuM: Plasma Processing for Advanced Logic Device Fabrications
- Eric Liu, TEL Technology Center, America, LLC, “Technology Options to Enable Logic Scaling in Advanced BEOL from Patterning to Metal Interconnect Formation”
PS+MS-TuA Modelling of Plasmas and Plasma Driven Processes
- Kallol Ber, f, Applied Materials, Inc, “3 Radio-frequency Hollow Cathode Discharge Characterization using Plasma and Machine Learning Models”
PS-WeM: Exploring Boundaries of Plasma Science: All invited talks including PSTD Award Lectures
- Scott Walton, Naval Research Laboratory, AVS Fellow Awardee Talk: “Electron Beam Driven Plasmas: Development and Use for Ultra Low TE Processing”
- Eric Joseph, IBM T. J. Watson Research Center, AVS Fellow Awardee Talk: “My Path to AVS Fellow: Non-Volatile Memory Processing from Fundamental Understanding to the Promise of Atomic Layer Etching and Sustainable Etch Precursors”
- Geun Young Yeom, Sungkyunkwan University, Republic of Korea, AVS Fellow Awardee Talk: “VHF Plasma Enhanced Atomic Layer Deposition of SiNx using Aminosilane Precursors”
- Luxherta Buzi, IBM Research, T. J. Watson Research Center, PSTD 2022Young Investigator Awardee talk: “Plasma Processing Challenges for Emerging Memory Technology”
- Satoshi Hamaguchi, Osaka University, Japan, Invited talk: “How Can Machine Learning Help Process Development?”
PS1+AS-WeA Plasma Chemistry, Catalysis and Applications for the Environment and Sustainability
- Elijah Thimsen, Washington University in St. Louis, “Synthesis of Hydrogen and Structural Carbon Materials from Methane Using Radiofrequency Nonequilibrium Plasma”
- Olivier Guaitella, Instituto Superior Técnico, Portugal, “Plasma-Surface Interaction in CO2 Containing Plasmas”
PS2+MS-WeA Plasma-Surface Modeling
- David Graves, Princeton University, “Modeling and Simulation of Plasma-Surface Interactions in Nanofabrication”
- Du Zhang, TEL Technology Center, America, LLC, “Yesterday, Today, and Tomorrow for HighAspect-Ratio Contact Etching: Unraveling the Mysteries of Plasma-Surface Interactions with Modeling and Simulations”
PS+NS-WeA Advanced Patterning and Plasma-Engineered Materials
- Danilo De Simone, IMEC, Belgium, “EUV Lithography Patterning towards Devices Nano Scaling”
- Shin Mou, Air Force Research Laboratory, Materials and Manufacturing Directorate, USA, “8 Recent Advances in Ga2O3 Material Development at AFRL”
PS1+MS-ThM AI/ML in Plasma Applications
- Tetsuya Nishizuka, Tokyo Electron Miyagi, Ltd., Japan, “Approaches to Accelerate Etch Process Optimization by Using Virtual Experiment”
PS2+AS+SS-ThM Plasma-Surface Interactions I
- John Daugherty, Lam Research Corporation, “Plasma-wall Interactions: Implications for Advanced Chamber Materials Requirements”
PS-ThA Plasma-Surface Interactions II
- Peter Bruggeman, University of Minnesota, “Plasma-Surface Interactions at Atmospheric Pressure: From Liquids to Catalytic Surfaces”
PS+SE-FrM Atmospheric Pressure Plasmas and Their Applications
- Alexander Fridman, Drexel University, Nyheim Plasma Institute, “Plasma Chemistry in Atmospheric Pressure Gases and Liquids: Fundamentals and Novel Applications”
- Judith Golda, Ruhr-University Bochum, Germany, “Fundamentals of Atmospheric Pressure Discharges for Plasma Catalytic Applications”
PS-TuP: Plasma Science and Technology Poster Session