The Electronic Materials and Photonics Division (EM) encompasses all aspects of advanced electronic and photonic materials including material synthesis, surface and interface engineering, computational materials science, machine learning, materials characterization, and materials integration into device applications. The division welcomes abstracts on these topics and those focused on enabling such materials advances as selective area patterning, novel deposition and etching, and machine learning materials discovery. In addition to general abstracts that fit the aforementioned scope, we are soliciting several sessions that align with the AVS 69 theme. With respect to transparent conductors, we are particularly interested in p-type TCO’s and organic conductors. We welcome submissions on the discovery and manipulation of electronic, magnetic, and topological properties materials using strain and strain gradients, and their application in devices. We invited abstracts on materials challenges related to all aspects of quantum materials enabling quantum computing, communications, and sensing; wide and ultra-wideband gap materials for power, IoT, 6G, electric vehicles, and improved grid resiliency; CMOS+X; Multiferroics; AI and machine learning for materials discovery; latest advances and future challenges in the development materials for active and passive components for the mid-IR; materials, processes, and technologies for advanced top-down and bottom-up patterning to meet next-generation device integration requirements; and neuromorphic computing. For the first time, we will be holding a focused session on early career speakers coordinated with the March 2023 JVST special issue. As in past years, we will offer multiple awards including a graduate student poster and presentation awards as well as post-doc and graduate student travel awards to help create a forum in which younger scientists can present their work and develop relationships for the future.
EMPD is also hosting the inaugural Early Career Professionals (ECP) Session highlighting the work accomplished by ECPs relating to electronic and photonic materials and devices. In addition to being open for contributed abstract submissions, the ECP Session will feature invited talks from the recipients of the 2022 JVST A Young Author Award
EM1: Advanced Materials for Electronic and Photonic Applications
- Paul Lane, National Science Foundation, “Minding the Gap: Advancing Electronics and Photonics through Materials Research”
EM2: Theme: Advanced Materials for Straintronics
- Harold Hwang, Stanford University, “Strain Manipulation of Ferroelectricity and Flexoelectricity”
EM3: Theme: CMOS+X: Piezoelectrics, Ferroelectrics and Multiferroics
- Jon Ihlefeld, University of Virginia, “Factors that Stabilize the Ferroelectric Phase of Hafnia”
EM4: CMOS+X: Emerging Memory Technologies
- Sean King, Intel
EM5: Theme: Recent Advancement in Transparent Conductors
- Andriy Zakutayez, National Renewable Energy Laboratory
EM6: Materials for Quantum Computation and Quantum Information
- Stephanie Law, Penn State University, “Collective Excitations in Topological Materials”
EM7+TF: Wide- and Ultra-Wide Band Gap Materials and Devices
- Grace Xing, Cornell University, “Ga2O3 and AlN for Power and RF Electronics”
EM8: Emergent Photonic Materials and Devices for Mid-IR Applications
- Kathleen Richardson, University of Central Florida
EM9+TF: Advanced Patterning and Fabrication for Device Scaling
- Luciana Meli, IBM
EM10: Materials and Device Advances for Neuromorphic Computing
- Mario Lanza, King Abdullah University of Science and Technology, Saudi Arabia, “Hexagonal Boron Nitride Based Memristors for Neuromorphic Computing”
EM11: Materials and Devices to Advance AI, and AI to Advance Materials and Devices
- Matthew Marinella, Arizona State University, “Devices for Energy Efficient Analog In-Memory AI Computing at the Edge”
EM12: Advancements in Microelectronics and Nanotechnology by Early Career Professionals
- Nicholas Glavin, Air Force Research Lab
- Deep Jariwala, University of Pennsylvania, “Heterostructures for Low-Power Logic and Memory Devices”
EM13: Electronic Materials and Photonics Poster Session